Electronic device and method of manufacturing the same, circuit board, and electronic instrument

ABSTRACT

An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which an electrode is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate; an insulating section formed of a resin and provided adjacent to the chip component; and an interconnect which is formed to extend from above the electrode, over the insulating section and to above the interconnect pattern.

Japanese Patent Application No. 2003-68279, filed on Mar. 13, 2003, ishereby incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to an electronic device and a method ofmanufacturing the same, a circuit board, and also an electronicinstrument.

With conventional chip-on-board (COB) mounting, the use of hightemperatures require the substrate to have thermal resistivity, makingit impossible to use a thermoplastic substrate. This makes it difficultto use an inexpensive substrate. In addition, since a semiconductor chipis subjected to external thermal or mechanical forces, it is difficultto avoid defects caused by the resultant stresses. When wire bonding isused, there are restrictions on the lengths of wires, so ageneral-purpose substrate cannot be used. Alternatively, if face-downbonding is used, it is necessary to use a special substrate that ismatched to the layout of the electrodes of the semiconductor chip, so itis not possible to use a general-purpose substrate therefore.

BRIEF SUMMARY OF THE INVENTION

An electronic device according one aspect of the present inventionincludes:

a substrate on which an interconnect pattern is formed;

a chip component having a first surface on which an electrode is formedand a second surface opposite to the first surface, the chip componentbeing mounted in such a manner that the second surface faces thesubstrate;

an insulating section formed of a resin and provided adjacent to thechip component; and

an interconnect which is formed to extend from above the electrode, overthe insulating section and to above the interconnect pattern.

An electronic device according another aspect of the present inventionincludes:

a substrate on which an interconnect pattern is formed;

a chip component having a first surface on which an electrode is formedand a second surface opposite to the first surface, the chip componentbeing mounted in such a manner that the second surface faces thesubstrate;

an insulating section provided adjacent to the chip component and havingan inclined surface descending in an outward direction from the chipcomponent; and

an interconnect which is formed to extend from above the electrode, overthe insulating section and to above the interconnect pattern.

A method of manufacturing an electronic device according to a furtheraspect of the present invention includes:

mounting a chip component having an electrode on a substrate on which aninterconnect pattern is formed, in such a manner that a second surfacefaces the substrate, the electrode being formed on a first surface andthe second surface being opposite to the first surface;

forming an insulating section of a resin adjacent to the chip component;and

forming an interconnect in such a manner as to extend from above theelectrode, over the insulating section and to above the interconnectpattern.

A method of manufacturing an electronic device according to a stillfurther aspect of the present invention includes:

mounting a chip component having an electrode on a substrate on which aninterconnect pattern is formed, in such a manner that a second surfacefaces the substrate, the electrode being formed on a first surface andthe second surface being opposite to the first surface;

forming an insulating section of a resin adjacent to the chip componentin such a manner that the insulating section has an inclined surfacedescending in an outward direction from the chip component; and

forming an interconnect in such a manner as to extend from above theelectrode, over the insulating section and to above the interconnectpattern.

A circuit board according to a yet further aspect of the presentinvention has the above electronic device mounted thereon.

An electronic instrument according to an even further aspect of thepresent invention has the above electronic device.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a sectional-view taken along the line I—I of FIG. 2;

FIG. 2 is a plan view of an electronic device in accordance with anembodiment of the present invention;

FIGS. 3A to 3C are illustrative of a method of manufacturing anelectronic device in accordance with the present invention;

FIG. 4 shows a modification of the electronic device in accordance withan embodiment of the present invention;

FIG. 5 shows another modification of the electronic device in accordancewith an embodiment of the present invention;

FIG. 6 shows a further modification of the electronic device inaccordance with an embodiment of the present invention;

FIG. 7 shows a still further modification of the electronic device inaccordance with an embodiment of the present invention;

FIG. 8 shows a yet further modification of the electronic device inaccordance with an embodiment of the present invention;

FIGS. 9A and 9B are illustrative of a method of manufacturing a chipcomponent shown in FIG. 8;

FIG. 10 shows a modification of the electronic device in accordance withan embodiment of the present invention;

FIG. 11 shows another modification of the electronic device inaccordance with an embodiment of the present invention;

FIG. 12 shows a further modification of the electronic device inaccordance with an embodiment of the present invention;

FIG. 13 shows a still further modification of the electronic device inaccordance with an embodiment of the present invention;

FIG. 14 shows a circuit board on which is mounted an electronic devicein accordance with this embodiment;

FIG. 15 shows an electronic instrument having an electronic device inaccordance with this embodiment; and

FIG. 16 shows another electronic instrument having an electronic devicein accordance with this embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENT

An embodiment of the present invention may reduce the requirement ofthermal resistivity of the substrate, enable a reduction in thegeneration of stresses in the semiconductor chip, and make it possibleto use a general-purpose substrate.

(1) An electronic device according one embodiment of the presentinvention include:

a substrate on which an interconnect pattern is formed;

a chip component having a first surface on which an electrode is formedand a second surface opposite to the first surface, the chip componentbeing mounted in such a manner that the second surface faces thesubstrate;

an insulating section formed of a resin and provided adjacent to thechip component; and

an interconnect which is formed to extend from above the electrode, overthe insulating section and to above the interconnect pattern.

This embodiment of the present invention makes it possible to avoid theuse of high-temperature heating such as that used for wire bonding orface-down bonding, when the electrodes are being connected electricallyto the interconnect pattern. The requirement of thermal resistivity forthe substrate is therefore reduced, enabling a reduction in the stressesgenerated in the chip component. In addition, the interconnect can beformed freely, enabling the use of a general-purpose substrate.

(2) With this electronic device, a side surface of the chip componentmay be inclined to descend in an outward direction from the firstsurface.

(3) With this electronic device, the chip component may have a step inan edge portion of the chip component.

(4) An electronic device according to another embodiment of the presentinvention includes:

a substrate on which an interconnect pattern is formed;

a chip component having a first surface on which an electrode is formedand a second surface opposite to the first surface, the chip componentbeing mounted in such a manner that the second surface faces thesubstrate;

an insulating section provided adjacent to the chip component and havingan inclined surface descending in an outward direction from the chipcomponent; and

an interconnect which is formed to extend from above the electrode, overthe insulating section and to above the interconnect pattern.

This embodiment of the present invention makes it possible to avoid theuse of high-temperature heating such as that used for wire bonding orface-down bonding, when the electrodes are being connected electricallyto the interconnect pattern. The requirement of thermal resistivity forthe substrate is therefore reduced, enabling a reduction in the stressesgenerated in the chip component. In addition, the interconnect can beformed freely, enabling the use of a general-purpose substrate.

(5) With this electronic device, the inclined surface may be a depressedsurface.

(6) With this electronic device, the inclined surface may be a projectedsurface.

(7) With this electronic device, the insulating section may be formed sothat part of the insulating section overlays the first surface.

(8) With this electronic device, the insulating section may be formed sothat part of the insulating section does not overlay the first surface.

(9) With this electronic device, the insulating section may have aportion higher than the first surface.

(10) This electronic device may further include a connection layer thatconnects the chip component with the substrate.

(11) With this electronic device, the connection layer may be formed ofthe same material as the insulating section.

(12) With this electronic device, the connection layer may be formed ofa material different from a material of the insulating section.

(13) A method of manufacturing an electronic device according to afurther embodiment of the present invention includes:

mounting a chip component having an electrode on a substrate on which aninterconnect pattern is formed, in such a manner that a second surfacefaces the substrate, the electrode being formed on a first surface andthe second surface being opposite to the first surface;

forming an insulating section of a resin adjacent to the chip component;and

forming an interconnect in such a manner as to extend from above theelectrode, over the insulating section and to above the interconnectpattern.

This embodiment of the present invention makes it possible to avoid theuse of high-temperature heating such as that used for wire bonding orface-down bonding, when the electrodes are being connected electricallyto the interconnect pattern. The requirement of thermal resistivity forthe substrate is therefore reduced, enabling a reduction in the stressesgenerated in the chip component. In addition, the interconnect can beformed freely, enabling the use of a general-purpose substrate.

(14) A method of manufacturing an electronic device according to a stillfurther embodiment of the present invention includes:

mounting a chip component having an electrode on a substrate on which aninterconnect pattern is formed, in such a manner that a second surfacefaces the substrate, the electrode being formed on a first surface andthe second surface being opposite to the first surface;

forming an insulating section of a resin adjacent to the chip componentin such a manner that the insulating section has an inclined surfacedescending in an outward direction from the chip component; and

forming an interconnect in such a manner as to extend from above theelectrode, over the insulating section and to above the interconnectpattern.

This embodiment of the present invention makes it possible to avoid theuse of high-temperature heating such as that used for wire bonding orface-down bonding, when the electrodes are being connected electricallyto the interconnect pattern. The requirement of thermal resistivity forthe substrate is therefore reduced, enabling a reduction in the stressesgenerated in the chip component. In addition, the interconnect can beformed freely, enabling the use of a general-purpose substrate.

(15) With this method of manufacturing an electronic device, theinterconnect may be formed of a dispersant including electricallyconductive particles.

(16) With this method of manufacturing an electronic device, the step offorming the interconnect may include ejecting the dispersant includingthe electrically conductive particles over the electrode, the insulatingsection and the interconnect pattern.

(17) With this method of manufacturing an electronic device, the step ofmounting the chip component on the substrate may include interposing anadhesive between the substrate and the chip component.

(18) With this method of manufacturing an electronic device, aninsulating adhesive may be used as the adhesive; and the adhesive may bepressed out from between the substrate and the chip component to aregion adjacent to the chip component, to form the insulating sectionfrom the adhesive.

(19) With this method of manufacturing an electronic device, the step offorming the insulating section may include providing a material to formthe insulating section besides the adhesive.

(20) A circuit board according to a yet further embodiment of thepresent invention has the above electronic device mounted thereon.

(21) An electronic instrument according to an even further embodiment ofthe present invention has the above electronic device.

An embodiment of the present invention is described below with referenceto the accompanying figures.

An illustrative view of an electronic device in accordance with anembodiment of the present invention is shown in FIG. 1, as asectional-view taken along the line I—I in FIG. 2. FIG. 2 is a plan viewof the electronic device in accordance with this embodiment of thepresent invention.

The electronic device has a chip component 10. The chip component 10could be an active component (such as an integrated circuit component)of a semiconductor component (such as a semiconductor chip), by way ofexample. An integrated circuit (not shown in the figures) could beformed in the chip component 10. If the chip component 10 is asemiconductor chip, the electronic device could be called asemiconductor device. The chip component 10 could also be a passivecomponent (such as a resistor, capacitor, or inductor).

A plurality of electrodes 14 is formed on a first surface 12 of the chipcomponent 10. The first surface 12 could be a quadrilateral (such as arectangle). The plurality of electrodes 14 could be formed along aperipheral portion (edge portion) of the first surface 12. The pluralityof electrodes 14 could be disposed along four edges of the first surface12, or they could be disposed along two edges. At least one electrode 14could be disposed at a central portion of the first surface 12.

A passivation film 16 including at least one layer could be formed onthe first surface 12. The passivation film 16 is an electricallyinsulating film. The passivation film 16 could be formed solely of amaterial that is not a resin (such as SiO₂ or SiN), or it could furtherinclude a film of a resin (such as a polyimide resin) formed thereover.An aperture that exposes at least part of each electrode 14 (such as acentral portion thereof) is formed in the passivation film 16. In otherwords, the passivation film 16 is formed to avoid at least the centralportion of each electrode 14. The passivation film 16 could cover theedge portions of the electrode 14. The passivation film 16 could also beformed to cover the entire peripheral portion of the first surface 12.

Electrodes are not formed on a second surface 18 of the chip component10 (on the surface opposite to that of the first surface 12). The secondsurface 18 could be in electrical contact with an integrated circuit(not shown in the figure), or it could be not connected thereto. Apassivation film (electrically insulating film) could be formed on thesecond surface 18 or it could be omitted therefrom. The second surface18 could be formed of a semiconductor (or conductor). A passivation film(electrically insulating film) could also be formed on the side surfacesof the chip component 10 (the surfaces other than the first and secondsurfaces 12 and 18) or it could be omitted therefrom. Electrodes are notformed on the side surfaces of the chip component 10. The side surfacesof the chip component 10 could also be formed of a semiconductor (orconductor).

The electronic device has a substrate 20. An interconnect pattern 22 isformed on the substrate 20. The interconnect pattern 22 includes anexposed portion 24 that reveals part of the surface of the substrate 20.An interconnect 34 for providing electrical connections between the chipcomponent 10 and the interconnect pattern 22 is formed on the exposedportion 24. The exposed portion 24 could also have a land (a portionthat is wider than a line; not shown in the figures).

The substrate 20 on which the interconnect pattern 22 is formed could betermed a wiring board. A wiring board could be a multi-layer board(including a two-sided board). A multi-layer board includes multiple(two or more) conductor patterns. In this case, the interconnect pattern22 could also include a second exposed portion 26 that reveals a secondsurface on the opposite side from the surface that the exposed portion24 reveals. The interconnect pattern 22 could also include a conductorpattern 28 within the substrate 20. The wiring board could also be awiring board incorporated in a component. More specifically, passivecomponents such as resistors, capacitors, and inductors or activecomponents such as integrated circuit components could be connectedelectrically to the conductor pattern 28 within the substrate 20.Alternatively, part of the conductor pattern 28 could be formed into aresistor by forming it of a high-resistance material.

The chip component 10 is mounted on the substrate 20. The second surface18 of the chip component 10 faces the substrate 20 (specifically, thesurface on which the exposed portion 24 is formed). A connection layer29 could be interposed between the chip component 10 and the substrate20. The connection layer 29 could be formed of an adhesive. The exposedportion 24 and the second surface 18 of the chip component 10 can beconnected electrically by making the connection layer 29 electricallyconductive. Alternatively, the exposed portion 24 and the second surface18 of the chip component can be isolated electrically by making theconnection layer 29 electrically insulating. The connection layer 29could be formed of a material that is an electrically insulatingdispersant including electrically conductive particles.

The electronic device has an insulating section 30. The insulatingsection 30 is formed of a material that is electrically insulating (suchas a resin). The insulating section 30 could be formed of a materialthat differs from that of the connection layer 29. The insulatingsection 30 is provided adjacent to the chip component 10. The insulatingsection 30 could be provided so as to surround the chip component 10, orit could be provided only in a region adjacent to each electrode 14 ofthe chip component 10. The insulating section 30 could also be placed incontact with the side surfaces of the chip component 10. In other words,the configuration could be such that there is no space between theinsulating section 30 and the chip component 10. In the example shown inFIG. 1, the insulating section 30 is provided in such a fashion that itdoes not surpass the height of the chip component 10. The upper edge ofthe insulating section 30 could be at the same height as the uppersurface of the chip component 10 (the surface of the passivation film16). In such a case, there is no step between the insulating section 30and the chip component 10. The configuration could be such that onlyportions of the side surfaces of the chip component 10 that are formedof a semiconductor or conductor are covered with the insulating section30. In such a case, the upper edge of the insulating section 30 is setlower than the upper surface of the passivation film 16.

The insulating section 30 has an inclined surface 32 that descends inthe outward direction from the chip component 10. The thickest part ofthe insulating section 30 is positioned closest to the chip component 10and the thinnest part thereof is positioned at the farthermost pointfrom the chip component 10. The insulating section 30 could be formedover part of the interconnect pattern 22 (specifically, the exposedportion 24 thereof).

The electronic device has an interconnect 34. Part of the interconnect34 is formed over each electrode 14. The interconnect 34 could also passover the passivation film 16. The interconnect 34 passes over theinsulating section 30. If the insulating section 30 is formed of aresin, the sealing between the insulating section 30 and theinterconnect 34 is higher than that between the passivation film 16 andthe interconnect 34. It is possible to prevent breakage of theinterconnect 34 by minimizing the difference in height between the chipcomponent 10 (such as the passivation film 16 thereof) and theinsulating section 30. The interconnect 34 is formed so as to be abovethe interconnect pattern 22 (specifically, the exposed portion 24thereof). In other words, the interconnect 34 connects the electrode 14with the interconnect pattern 22 electrically.

The electronic device could be provided with a plurality of externalterminals 36. The external terminals 36 could be provided above theinterconnect pattern 22 (such as in the second exposed portion 26). Theexternal terminals 36 could be formed of a soldering material. Asoldering material is a metal (such as an alloy) which is electricallyconductive and which is designed to create an electrical connection onmelting. The soldering material could be either a soft solder or a hardsolder. A solder that does not include lead (hereinafter called alead-free solder) could be used as the soldering material. A tin-silver(Sn—Ag), tin-bismuth (Sn—Bi), tin-zinc (Sn—Zn), or tin-copper (Sn—Cu)alloy could be used as the lead-free solder, and at least one of silver,bismuth, zinc, and copper could be added to that alloy.

Known packages that have such external terminals 36 are ball-grid array(BGA) packages and chip-size packages (CSP). Alternatively, anotherknown type of package is a land-grid array (LGA) package that is notprovided with the external terminals 36 but part of the interconnectpattern 22 (such as the second exposed section 26) forms an electricalconnective portion with the exterior.

The electronic device could also have a sealing member 38. The sealingmember 38 seals at least the electrical connective portion between theinterconnect 34 and each electrode 14 and the electrical connectiveportion between the interconnect 34 and the interconnect pattern 22. Thesealing member 38 could also seal in the chip component 10.

FIGS. 3A to 3C are illustrative of a method of manufacturing anelectronic device in accordance with the present invention, with thechip component 10 being mounted on the substrate 20 as shown in FIG. 3A.Specifically, the chip component 10 is mounted so that the secondsurface 18 thereof faces the substrate 20. An adhesive could beinterposed between the substrate 20 and the chip component 10, to formthe connective layer 29.

As shown in FIG. 3B, the insulating section 30 is formed adjacent to thechip component 10. The insulating section 30 could be formed of amaterial that differs from the adhesive that forms the connection layer29. The insulating section 30 could be formed of a resin such as apolyimide resin, a silicone denatured polyimide resin an epoxy resin, asilicone denatured epoxy resin, benzocyclobutene (BCB), orpolybenzoxazole (PBO). The insulating section 30 could be formed bypotting with a liquid resin, or it could be formed by fixing a dry film.The insulating section 30 is formed to have the inclined surface 32 thatdescends outward from the chip component 10. The insulating section 30could also be formed to be in contact with the side surfaces of the chipcomponent 10.

As shown in FIG. 3C, the interconnect 34 is formed. The interconnect 34is formed so as to extend from above each electrode 14, passing over theinsulating section 30, and to above the interconnect pattern 22 (such asthe exposed portion 24 thereof). The interconnect 34 could be formed ofa dispersant including electrically conductive particles. An inkjetmethod could be used therefor, by way of example. More specifically, adispersant including electrically conductive particles could be ejectedover the electrode 14, the insulating section 30, and the interconnectpattern 22 (such as the exposed portion 24), to form the interconnect34. The process of forming the interconnect 34 could include the removalof the dispersant medium by drying the dispersant that includes theelectrically conductive particles. The process of forming theinterconnect 34 could also include the thermal decomposition of acoating material that covers the electrically conductive particles. Theprocess of forming the interconnect 34 could also include a step ofpolymerizing the electrically conductive particles. The electricallyconductive particles could be nanoparticles. In such a case, the volumeresistivity of the dispersant can be reduced.

The sealing member 38 could be provided, as shown in FIG. 1. The sealingmember 38 could be formed by a transfer mold or by potting The sealingmember 38 could also be omitted.

When the electrode 14 and the interconnect pattern 22 in accordance withthis embodiment are connected electrically, it is possible to avoidusing high-temperature heating such as that used during wire bonding orface-down bonding. The requirement that the substrate 20 should havethermal resistivity is therefore reduced, enabling a reduction in thestresses generated in the chip component 10. A general-purpose substratecan be used as the substrate 20, making it possible to route theinterconnect 34 to suit the chip component 10 (such as the arrangementof the electrodes 14 thereof). In such a case, the interconnect 34 couldconnect different portions of the interconnect pattern 22, depending onthe type of chip component 10.

FIGS. 4 to 13 show modifications of the electronic device in accordancewith further embodiments of the present invention.

In FIG. 4, an insulating section 40 is formed so that part thereof risesup over the first surface 12 of the chip component 10 (specifically, thepassivation film 16 thereof). Part of the insulating section 40 overlaysa portion closer to the peripheral side of the electrode 14 of the chipcomponent 10. To prevent the electrode 14 being covered by theinsulating section 40, the insulating section 40 could be made to stopat a position some distance from the electrode 14 (at a position nearerthe periphery than the electrode). Alternatively, the insulating section40 could be formed adjacent to the portion of the electrode 14 that isexposed from the passivation film 16. In such a case, the interconnect42 does not overlay the passivation film 16 that has a low sealingcapacity therewith. The insulating section 40 has a portion in contactwith the chip component 10 that rises above the first surface 12. Therest of the configuration is the same as that of the electronic deviceof FIG. 1.

In FIG. 5, an insulating section 44 is formed so that part thereof doesnot overlay the first surface 12 of the chip component 10. Theinsulating section 44 has a portion in contact with the chip component10 that rises above the first surface 12. The insulating section 44 hasa step-shaped portion on the side opposite to the chip component 10. Therest of the configuration is the same as that of the electronic deviceof FIG. 1.

In FIG. 6, an insulating section 50 and a connection layer 52 are formedintegrally. The connection layer 52 is formed of the same material asthe insulating section 50. The insulating section 50 and the connectionlayer 52 could be formed from an adhesive by providing an insulatingadhesive between the substrate 20 and the chip component 10, thenapplying a compressive force between the substrate 20 and the chipcomponent 10 so that the adhesive is pressed out to a region adjacent tothe chip component 10. An inclined surface 54 of the insulating section50 is a depressed surface (such as a concave surface that draws a curveas seen in a section perpendicular to the first surface 12). The rest ofthe configuration is the same as that of the electronic device ofFIG. 1. The configuration of FIG. 6 can also be used in otherembodiments or modifications.

In FIG. 7, an insulating section 60 and a connection layer 62 are formedintegrally. The connection layer 62 is formed of the same material asthe insulating section 60. The insulating section 60 and the connectionlayer 62 could be formed from an adhesive by providing an insulatingadhesive between the substrate 20 and the chip component 10, thenapplying a compressive force between the substrate 20 and the chipcomponent 10 so that the adhesive is pressed out to a region adjacent tothe chip component 10. An inclined surface 64 of the insulating section60 is a projected surface (such as a convex surface that draws a curveas seen in a section perpendicular to the first surface 12). The rest ofthe configuration is the same as that of the electronic device ofFIG. 1. The configuration of FIG. 7 can also be used in otherembodiments or modifications.

In FIG. 8, a chip component 70 has a side surface 74 that is inclined soas to descend in the outward direction from a first surface 72 thereof(a surface on which the electrodes 14 are formed). Since the sidesurface 74 is inclined, it is easy to provide an insulating section 75with an inclined surface thereon. The chip component 70 could alsoinclude a side surface 78 that rises perpendicularly from the secondsurface 76 opposite to the first surface 72. The side surfaces 74 and 78could also be connected. The rest of the configuration is the same asthat of the electronic device of FIG. 1. The configuration of FIG. 8 canalso be used in other embodiments or modifications.

The side surface 74 could be formed when the wafer (such as asemiconductor wafer) 80 is cut apart, as shown in FIG. 9A. Morespecifically, a cutter (such as a dicing saw) 82 in which two slicingblades are connected at an angle like an angle milling cutter could beused to form a groove (such as a V-shaped groove) having inclinedsurfaces in the wafer 80, where these inclined surfaces become the sidesurfaces 74. After the groove has been formed, the base of the groovecould be cut by a cutter (such as a dicing saw) 84 having a slicingblade along the external peripheral surfaces. This makes it possible toform the side surface 78 that rises perpendicularly from the secondsurface 76.

In FIG. 10 a side Surface 94 of a chip component 90 is inclined so as todescend in the outward direction from a first surface (a surface onwhich the electrodes 14 are formed) 92. The side surface 94 is alsoinclined with respect to a second surface 96 on the opposite side fromthe first surface 92. The rest of the configuration is the same as thatof the electronic device of FIG. 1. The configuration of FIG. 10 canalso be used in other embodiments or modifications.

In FIG. 11, an edge portion of a chip component 100 has a step 102. Thestep 102 includes a surface that descends (such as perpendicularly) froma first surface (a surface on which the electrodes 14 are formed) 104, asurface that rises (such as perpendicularly) from a second surface 106opposite to the first surface 104, and a surface that extends in thelateral direction (such as parallel to either the first or secondsurface 104 or 106) to connect the other two surfaces. The rest of theconfiguration is the same as that of the electronic device of. FIG. 1.The configuration of FIG. 11 can also be used in other embodiments ormodifications.

In FIG. 12, a second chip component 110 is mounted on a surface of thesubstrate 20 on the opposite side from the surface on which the chipcomponent 10 is lo mounted. The second chip component 110 is connectedelectrically to the interconnect pattern 22 (specifically, the secondexposed portion 26). The mounting state of the second chip component 110could be either face-down bonding or face-up bonding. With face-downbonding, the electrodes (bumps) of the second chip component 110 facethe interconnect pattern 22 and are electrically connected thereto. Withface-up bonding, wires could be used to form the electrical connections.The rest of the configuration is the same as that of the electronicdevice of FIG. 1. The configuration of FIG. 12 can also be used in otherembodiments or modifications.

In FIG. 13, a second chip component 120 is mounted on a surface of thesubstrate 20 on which the chip component 10 is mounted. The second chipcomponent 120 could be disposed higher than the chip component 10 (or tocover the chip component 10), by way of example. The second chipcomponent 120 is connected electrically to the interconnect pattern 22(specifically, the exposed portion 24). The mounting state of the secondchip component 120 could be either face-down bonding or face-up bonding.With face-down bonding, the electrodes (bumps) of the second chipcomponent 120 face the interconnect pattern 22 and are electricallyconnected thereto. With face-up bonding, wires could be used to form theelectrical connections. The rest of the configuration is the same asthat of the electronic device of FIG. 1. The configuration of FIG. 13can also be used in other embodiments or modifications.

A circuit board 1000 on which is mounted an electronic device 1 asdefined by any of the above-described embodiments is shown in FIG. 14. Anotebook-type personal computer 2000 shown in FIG. 15 and a mobile phone3000 shown in FIG. 16 are examples of electronic instruments having thiselectronic device.

The present invention is not limited to the above-described embodimentsand thus various modifications thereto are possible. For example, thepresent invention also includes configurations that are substantiallythe same as the configurations described with reference to theembodiments herein (such as embodiments that have the same function,method, and effect or embodiments that have the same objective andeffect). The present invention also includes the substitution ofcomponents that mentioned in a non-essential part of the description ofthe embodiments herein. Furthermore, the present invention also includesconfigurations that can achieve the same operating effect or the sameobjective as the embodiments described herein. The present inventionfurther includes configurations wherein known techniques are added tothe embodiments described herein.

1. An electronic device comprising: a substrate on which an interconnectpattern is formed; a chip component having a first surface on which anelectrode is formed and a second surface opposite to the first surface,the chip component being mounted in such a manner that the secondsurface faces the substrate, the chip component having a passivationfilm formed on the first surface; an insulating section formed of aresin and provided adjacent to the chip component; and an interconnectwhich is formed to extend from above the electrode, directly on theinsulating section, on the passivation film, and above the interconnectpattern, the insulating section being formed so that part of theinsulating section under the interconnect does not overlay the firstsurface.
 2. The electronic device as defined by claim 1, wherein a sidesurface of the chip component is inclined to descend in an outwarddirection from the first surface.
 3. The electronic device as defined byclaim 1, wherein the chip component has a step in an edge portion of thechip component.
 4. The electronic device as defined by claim 1, whereinthe insulating section has a portion higher than the first surface. 5.The electronic device as defined by claim 1, further comprising: aconnection layer that connects the chip component with the substrate. 6.The electronic device as defined by claim 5, wherein the connectionlayer is formed of the same material as the insulating section.
 7. Theelectronic device as defined by claim 5, wherein the connection layer isformed of a material different from a material of the insulatingsection.
 8. An electronic device comprising: a substrate on which aninterconnect pattern is formed; a chip component having a first surfaceon which an electrode is formed and a second surface opposite to thefirst surface, the chip component being mounted in such a manner thatthe second surface faces the substrate, the chip component having apassivation film formed on the first surface; an insulating sectionprovided adjacent to the chip component and having an inclined surfacedescending in an outward direction from the chip component; and aninterconnect which is formed to extend from above the electrode,directly on the insulating section, on the passivation film, and abovethe interconnect pattern, the insulating section being formed so thatpart of the insulating section under the interconnect does not overlaythe first surface.
 9. The electronic device as defined by claim 8,wherein the inclined surface is a depressed surface.
 10. The electronicdevice as defined by claim 8, wherein the inclined surface is aprojected surface.
 11. The electronic device as defined by claim 8,wherein the insulating section has a portion higher than the firstsurface.
 12. The electronic device as defined by claim 8, furthercomprising: a connection layer that connects the chip component with thesubstrate.
 13. The electronic device as defined by claim 12, wherein theconnection layer is formed of the same material as the insulatingsection.
 14. The electronic device as defined by claim 12, wherein theconnection layer is formed of a material different from a material ofthe insulating section.
 15. A circuit board on which an electronicdevice as defined in claim 1 is mounted.
 16. A circuit board on which anelectronic device as defined in claim 8 is mounted.
 17. An electronicinstrument having an electronic device as defined in claim
 1. 18. Anelectronic instrument having an electronic device as defined in claim 8.